| Features | Capability | Description |
|---|---|---|
| Layer count | 1-8 Layers | The number of copper layers in the PCB |
| Impedance Control Tolerance | ±10% | |
| Maximum Dimensions | FR4 PCB: 300 x 300 mm | These limits apply to FR4 PCBs with thickness ≥ 1.0 mm. |
| Minimum Dimensions | Regular: 8x8 mm | These limits apply to PCBs with thickness ≥ 1.0 mm. Manual review required for thinner PCBs. Panelization is recommended for small-sized boards. |
| Dimension Tolerance | ±0.2mm | ±0.2mm(Regular) for CNC routing, and ±0.4mm for V-scoring |
| Thickness | 1.0 / 1.6mm | Overall board thickness including mask layer and HASL |
| Thickness Tolerance (Thickness≥1.0mm) | ± 10% | e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6x10%) to 1.76mm(T+1.6x10%) |
| Finished Outer Layer Copper | 1 oz / 2 oz | |
| Finished Inner Layer Copper | 0.5 oz / 1 oz / 2 oz | Finished copper weight of inner layer is 0.5oz by default. |
| Soldermask | Green, Red, Yellow, Blue, White, and Black. | |
| Surface Finish | HASL (leaded / lead-free), ENIG |
| Features | Capability | Description |
|---|---|---|
| Drill Diameter | 1-layer: 0.3 - 6.3 mm 2-layer: 0.2 - 6.3 mm Multilayer: 0.2 - 6.3 mm |
Holes with diameter ≥ 4 mm are CNC routed from a smaller drilled hole. Min. drill diameter for 2- or more-layer PCBs is 0.2 mm (more costly!) |
| Hole size Tolerance (Non-Plated) | ±0.2mm | e.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable. |
| Blind/Buried Vias | Not supported | Currently we don't support Blind/Buried Vias, only make through holes. |
| Min. via hole size/diameter | 0.2mm / 0.4mm | 1-layer (NPTH only): 0.3 mm hole size / 0.5 mm via diameter 2-layer: 0.2mm hole size / 0.4mm via diameter Multilayer: 0.2 mm hole size / 0.35 mm via diameter Via diameter should be 0.15mm larger than Via hole size. |
| Min. Non-plated holes | 0.50mm | Please draw NPTHs in the mechanical layer or keep out layer. |
| Min. Plated Slots | 0.5mm | The minimum plated slot width is 0.5mm, which is drawn with a pad. The length of the slot should be at least 2 times of the width. |
| Min. Non-Plated Slots | 1.0mm | The minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GML or GKO) |
| Via Hole-to-Hole Spacing | 0.2mm | |
| Pad Hole-to-Hole Spacing | 0.45mm | |
| Rectangular Holes / Slots | Not supported | Rectangular holes and slots without rounded corners are not supported. |
| Features | Capability | Description |
|---|---|---|
| Min. track width and spacing (1 oz) | 0.15 / 0.2 mm (6 / 8 mil) | 1-layer: 0.2 / 0.2 mm (8 / 8 mil) 2-layer: 0.15 / 0.2 mm (6 / 8 mil) Multilayer: 0.127 / 0.127 mm (5 / 5 mil). |
| Min. track width and spacing (2 oz) | 0.2 / 0.2 mm (8 / 8 mil) | Same limits for single-layer and multi-layer |
| Track width tolerance | ±20% | e.g. For a 0.1 mm track, the finished track width ranges from 0.08 and 0.12 mm. |
| PTH annular ring | ≥0.20mm | 2-layer: 1 oz: Recommended 0.25 mm or above; absolute minimum 0.2 mm 2 oz: 0.3 mm or above Multilayer: 1 oz: Recommended 0.20 mm or above; absolute minimum 0.15 mm 2 oz: 0.3 mm or above |
| NPTH pad annular ring | ≥0.45mm | Recommended 0.45 mm or more. This is to allow a 0.2 mm ring of copper to be removed around the hole for the sealing film to attach. Pad sizes smaller than the recommended value can result in the annular ring being very thin or completely missing. |
| BGA | Not supported | |
| Hatched grid width and spacing | 0.3 mm | |
| Same-net track spacing | 0.25mm | |
| Inner layer via hole to copper clearance | 0.2mm | |
| Inner layer PTH pad hole to copper clearance | 0.3mm | |
| Pad to track clearance | 0.15mm | Min. 0.127 mm (stay well above if possible). |
| SMD pad to pad clearance (different nets) | 0.15mm | |
| Via hole to Track | 0.3mm | |
| PTH to Track | 0.35mm | |
| NPTH to Track | 0.3mm |
| Features | Capability | Description |
|---|---|---|
| Minimum Line Width | 0.15mm (6 mil) | 0.2mm (8 mil) recommended. Characters width less than 6mil (0.15mm) will be unidentifiable. |
| Minimum text height | 1.0mm (40 mil) | Characters height less than 1.0mm (40 mil) will be unidentifiable. |
| Pad To Silkscreen | 0.2mm | The absolute minimum Distance Between Pad and Silkscreen is 0.15mm. |
| Features | Capability | Description |
|---|---|---|
| Routed | 0.2mm | 1. Copper clearance from routed board edges: ≥0.2 mm 2. Copper clearance from routed slots: ≥0.2 mm 3. Dimension tolerance for routed board edges: ±0.2 mm (regular precision) |
| V-Cut | 0.4mm | 1. Copper clearance from V-cut board edges: ≥0.4 mm 2. Dimension tolerance for V-cut board edges: ±0.4 mm. PCB thickness ≥ 0.6 mm 3. Zero panel board spacing by default. Alternatively, V-cut along one direction with no spacing and route along the other direction with 1.6 or 2 mm board spacing. 4. Min. panel dimensions: 70 × 70 mm; max. panel dimensions: 300 × 300 mm 5. V-cut groove angle: 25° |
| Mouse bites Panel | 0.2mm Recommended: 0.6mm holes at 1.0mm distance within a 5mm mousbite tab. |
1. Copper clearance from non-mouse-bite board edges: ≥0.2 mm 2. Dimension tolerance for non-mouse-bite board edges: ±0.2 mm (regular precision) 3. Panel board spacing: 2 mm 4. Serrated edges will remain after depanelization 5. Minimum tooling edge width: 5mm. For automated SMT assembly, use 6mm tooling edges, 2.5mm tooling holes, and 1 mm fiducials centered at 3.85 mm from the panel edges. 6. Recommended diameter of mouse bite is 0.5mm-0.8mm. Recommended distance between the two mouse-bite hole center is 0.4-1.0mm. The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm. |
| Panelization with space | 2mm | The spacing between boards should be ≥ 2 mm, as narrow spacing results in difficulties for routing and V-cut. |
| Panel of Circular PCBs | ≥20mmx20mm | The single round board size should be ≥20mm × 20mm for panelization. Panelize with stamp holes and add tooling strips on four board edges |
| Features | Economic PCBA | Standard PCBA |
|---|---|---|
| Assembly Types | Single sided placement (SMT/Thru-hole) | Single & double sided placement (SMT/Thru-hole) |
| Thickness | 1mm - 1.6mm | 0.6mm - 4.5mm |
| Dimension | Single PCB size (individual or panel): 20x20mm - 250x250mm |
Single PCB Size: 20x20mm - 300x300mm PCB Panel Size: 70x70mm - 300x300mm |
| Maximum number of unique components | 100 | 180 |
| Order Volume | 3 - 100 pcs | 3 - 25,000 pcs |
| Delivery Format | Single PCB Panel |
Single PCB Panel |
| Edge Rails | Not necessary. Added by PCBSage if required. |
Required for Panel orders. Added by PCBSage for single PCB order. |
| Fiducials | Added by PCBSage if required. | Required in design. Added by PCBSage if not present. |
| Minimum Package | 0402 imperial (metric 1005) No LGA & BGA |
0402 imperial (metric 1005) LGA (reviewed by PCBSage) No BGA |
| Minimum IC Pin Spacing | 0.4mm | 0.3mm |
| Minimum IC Pad (QFN / LGA type) Spacing | 0.3mm | 0.15mm |
| Maximum component height | 4mm | 5mm |
| Maximum component size | 12x12mm | 16x16mm |
| Solder paste options | Standard 183C temperature: Leaded & Lead-free (T3-T4 type) | Standard 183C temperature: Leaded & Lead-free (T3-T4 type) Low 138C temperature: Lead-free (T3-T4 type) |
| Reflow temperature | 240+/-5 °C | Standard: 240+/-5 °C Low temperature: 175+/-10 °C |
| Solder Paste Inspection (SPI) | No | Yes |
| Automated Optical Inspection (AOI) | No | Yes |
| Visual Inspection | Yes | Yes |
| X-ray Inspection | No | No |
| PCBA Sampling | No | Yes (mention in order) |
| Build time | 1 to 5 days | > 3 days |
| Feature | Capabilities |
|---|---|
| Stencil Types | Framed (for mass production) & Frameless (for prototypes) |
| Stencil Material | Stainless steel |
| Minimum Aperture Size | >0.2mm |
| Cutting Tolerance | ±0.0254mm |
| Cutting Technology | Laser Cutting |
| Stencil File Formats | Gerber file (solder paste layers) |
| Thickness | Selected by PCBSage Our engineers will select an appropriate thickness based on your design from the standard thickness. Specified by customer If you wish to specify the thickness by yourself, please choose 'Select by Customer' option. Thickness options: 0.10mm (4mil), 0.127mm (5mil), 0.15mm (6mil), 0.20mm (8mil). |
| Dimensions | Frameless: Automatic: Size selected PCBSage Engineer. Will be board size + padding. Custom size: You can specify dimensions from 100x100mm to 300x300mm. Framed: Minimum: 18x18inch (Working Area 280x280mm) Maximum: 28x28inch (Valid Area: 550x550mm) For rectangular shape: Min length: 18inch, Max length: 28inch. Note: Valid Area is where the appertures can be opened and paste be applied. |
| Step Stencil | Please contact us. |
| Stencil Side |
1. Top Only 2. Bottom Only 3. Top + Bottom (On Separate Stencils) 4. Top + Bottom (On Single Stencil). Only for PCB size < 200x200mm |
| Fiducials |
1. No Fiducial 2. Etched Through 3. Etched Half Into |
| Build Time | Fastest build time: 36 hours Note: The final build time may vary based on the selected stencil specifications and order confirmation time. |
| Schematic Capture | Comprehensive circuit design with detailed BOM generation and component lifecycle/risk analysis tailored for manufacturability. |
| High-Speed Layout | Advanced impedance matched routing, precise differential pair tuning, and EMI/EMC optimized multi-layer board design. |
| Embedded C/RTOS | Robust firmware development for ARM, ESP32, RISC-V, 8051, STM8, AVR (Ateml), Linux, and custom MCU architectures with extensive FreeRTOS and bare-metal support. |
| Signal Integrity | Rigorous pre and post-layout simulations to ensure bulletproof data transfer across complex high-speed interfaces like DDR, PCIe, and USB 3.0. |
| Turnkey Product Development | End-to-end design, prototyping, and final product manufacturing tailored to your exact specifications. |
| Box Build Assembly | Comprehensive mechanical assembly, enclosure housing, wiring, and packaging of final products. |
| Lifecycle Management | Proactive component sourcing, obsolescence management, and redesign for long-term product viability. |